The TE Connectivity compliant ACTION PIN and Multispring contacts provide reliable electro-mechanical connection to plated-through pc board holes. Since TE Connectivity compliant contacts do not have to be soldered, the following problems associated with solder are eliminated: ■ Faulty soldered joint ■ Solder fumes (contacts become contaminated) ■ Solder spots (short circuits between printed circuits) ■ Flux residues ■ Thermal strain on PCBs and components ■ Degasing of plated-through holes.
Large gas-tight contact zone
High reliability due to stored energy
Minimum damage to plated-through holes during application
Especially suited for multilayer PCBs
More economic board manufacturing due to larger hole tolerances compared to the use of a solid pin
Application can be made by the end-user
High-end TE Connectivity application tooling available
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